At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, ...

Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...

Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Monolithic three-dimensional (M3D) integration is being increasingly adopted by the semiconductor industry as an alternative to traditional through-silicon via technology as a way to increase the ...

Optoelectronic integrated circuits can leverage the large bandwidth and low interconnect delay of optical communications. Developing a three-dimensional optoelectronic integrated circuit architecture ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

Nearfield Instruments, a leader in advanced semiconductor 3D metrology and process control, today announced the successful closure of a $380 million Series D funding round. The transaction values the ...

Professor Tim Cheng adn Dimitri Strukov at the University of California at Santa Barbara described how 3-D techniques could realize the dream of semiconductor memristors. Using a hybrid 3-D ...

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...