Three years ago, Intel engineer Wilfred Gomes and his colleagues sat down to decide how the future should look. The team had just finished its work on Intel's next-generation high-performance and ...

Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ...

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On Wednesday, Intel officially announced two “Lakefield” chips, otherwise known as the 9-watt “Intel Core processor with Intel Hybrid Technology,” which will be showcased in thin-and-light PCs like ...

Intel’s new Lakefield processors are the company’s first hybrid processors that combine higher-performance Intel Core CPU cores with energy-efficient Atom cores. They’re basically Intel’s answer to ...

Later this year Intel plans to launch its first Alder Lake mobile processors designed to combine two different CPU architectures on a single chip. The idea is to deliver up to a 14-core processor that ...

This week Intel announced the official launch of its Core processors that feature the Intel Hybrid Technology that are known by the codename "Lakefield." The processors are built using Intel's Foveros ...

Intel has kicked off the hype train for its next-gen Lakefield processor, which will be the first to use Intel's new Foveros 3D packaging technology, and will start production later in the year. The ...

Intel today announced its innovative Lakefield SoC design, a new style of chip using the Foveros chip-stacking technology to create tiny full PC boards for a new breed of thin-and-light laptops and ...