Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known as Rapidus Chiplet ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including ...

On the 20th, local time, at the research building of Lam Research, a semiconductor company in Salzburg, Austria. Here, the ...

Semiconductor manufacturing faces a new bottleneck. See how advanced packaging and laser-based tooling fix back-end supply chains.

This fab-in-a-box startup thinks semiconductor manufacturing has become too expensive and wants compact systems replacing ...

Overview India is rapidly strengthening its semiconductor manufacturing ecosystem with major investments, government ...

On May 7, the German technology firm Aixtron signed an agreement with the Malaysian Investment Development Authority to build a $47 million semiconductor manufacturing facility in Malaysia, with ...