Intel Corporation and Arizona-based 3D Glass Solutions (3DGS) are exploring a $3.3-billion investment in Odisha to set up India’s first advanced semiconductor glass core packaging substrate ...

Intel Corporation and 3D Glass Solutions have signed an MoU with the Odisha government to explore setting up an advanced semiconductor glass core packaging substrate facility in the state. The ...

Intel signs pact with Odisha & 3DGS to bring semiconductor substrate manufacturing tech to India. $3.3B investment, 1800+ jobs.

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

(MENAFN- The Arabian Post) clearfix"> Odisha has secured a proposed $3.3 billion semiconductor substrate project involving Intel Corporation and 3D Glass Solutions Inc., marking one of the largest ...

The fight over who makes the world’s chips is increasingly a fight over the parts of a chip nobody photographs. India has just landed one of them. Intel and 3D Glass Solutions have signed an agreement ...

Intel and 3DGS explore a semiconductor packaging facility in Odisha. Discover how this project could transform India's tech landscape!

The proposed Intel-3DGS glass substrate facility will not make chips, but it could help India secure a place in the supply ...

Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated capability—advanced packaging. While Taiwan ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...