AI has been a powerful force in the embedded electronics industry, although it’s still in its infancy. It has a great promise to automate systems in every facet of the industry, yet it’s not a silver ...

Three of Electronic Design’s most colorful editors will be attending North America’s leading power conference and would love ...

UCIe 3.0 springs open the door to higher speeds, enhanced link reliability, and smarter system coordination for increasingly complex chiplet packaging needs.

Check out the breaking news, videos, and podcasts at this year's Embedded World conference. Mick Posner highlights Cadence’s chiplet platform to support physical AI development. Multiphase Power ...

In celebration of International Women's Day, I did a special drawing to capture the event.

Using LnFP technology as an active material, OMI said it has developed a rapid ion transport cathode designed to handle ...

A hybrid DC-DC converter topology boosts efficiency by combining a buck regulator and a charge pump. Is it the future of intermediate bus conversion?

Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...

Tensor integrates more than 400 Arm-based cores per vehicle, underpinning its AI-first approach to Level 4 autonomy.

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Magicians aren’t the only ones who use these techniques. While magicians tend to be above board and will return anything they ...

What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC ...