Marvell introduces the Structera S 30260, a next‑generation CXL switch designed to enable rack‑level memory pooling.

TE Connectivity has unveiled its new 56G MezzaWave connector and cable assembly range to meet growing data demands.

Parasoft has announced new capabilities for its automated testing tools for C and C++ software, introducing TÜV‑certified ...

The module combines ST’s imaging, depth‑mapping and motion‑sensing technologies with NVIDIA’s Holoscan Sensor Bridge, ...

Siemens has introduced a new artificial intelligence system designed to automate complex engineering processes.

AI computing is no longer just helping the energy system; it is becoming a major consumer of energy in its own right.

Diodes Incorporated has expanded its automotive power management lineup with the launch of the AL8859Q, a multi‑phase ...

The European Chips Act is beginning to have a tangible impact on how semiconductors are developed and manufactured.

A key feature of the NCC design is a spring‑loaded plastic cover that automatically seals the contacts of the female ...

For years, South Korea’s leading memory manufacturers, including Samsung and SK Hynix, have preferred shorter quarterly or annual agreements, especially in periods when supply w ...

Nisshinbo Micro Devices has introduced the NT1199, a wideband low noise amplifier designed to support the growing demand for ...

FORVIA HELLA has selected the TEF8388 for its next‑generation radar sensor platform. The supplier confirmed that its first high‑resolution radar programme using the new transceiver and NXP’s S32R47 ...