Researchers have developed a transistor technology that enables a single semiconductor device to perform ...

A vacuum channel transistor controls electrons at the cathode to suppress gate leakage, letting it work inside amplifiers and ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

POSTECH develops a low-temperature heterojunction-based transistor that implements complex circuits with a single device.

Engineers at MIT have produced the smallest three-dimensional transistor ever reported, a device so compact that a chip ...

Just as Huawei introduced its ambitious “Tau (τ) Law” semiconductor strategy at ISCAS 2026 today, the company also shared more details about its upcoming Kirin mobile processor. In our previous report ...

From chiplets to vertical stacking, new design approaches are emerging as traditional transistor scaling runs into physical ...

Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance ...

For decades, the computing industry has followed a simple formula: make transistors smaller and pack more of them onto a chip. That strategy fueled ...

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

A cast silicone membrane forms the face of the clock [top], while behind it sits 3D-printed millifluidic blocks [middle rows] ...