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Fractal Design Node 202

Discover the compact and innovative world of the Fractal Design Node 202! This video dives into the sleek design and ...
IEEE

Thermal-Mechanical Modeling of Package Reflow for Cooling of Future CPU and GPU Devices

Abstract: Future data centers will employ large-area (greater than 25 mm × 25 mm), high-heat-flux (greater than 1 kW/cm2) central processing unit (CPU) and graphics processing unit (GPU) devices. Such ...