In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

A basic building block is often the key to completing an analog signal path in various applications, such as automated test equipment.

In his latest video, a self-professed “science nerd” and amateur high-energy physicist shows us what happens when you give a ...

VisualSim Architect shows how system-level modeling can expose latency, power, and thermal tradeoffs early in chiplet-based ...

Parallel battery-management ICs provide new ways to stretch out the limited runtime of smart glasses and AR/VR goggles.

Andy’s back from the 2026 Analog Aficionados meetup, held at DesignCon this year, and pieces together some history of the event as well as launching a downloadable annual ...

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

AI has been a powerful force in the embedded electronics industry, although it’s still in its infancy. It has a great promise to automate systems in every facet of the industry, yet it’s not a silver ...

EPC claims its seventh-generation, 40-V power transistor delivers up to 3X better performance than equivalent silicon MOSFETs.

Why security is important to the chiplet supply chain. Synopsys' 3DIC Compiler platform, enhanced by AI optimizations, handles multi-die and advanced chiplet packaging co-design and optimization for 2 ...

That’s March 14 th, in case you don’t know. What better way to celebrate than with harvesting some Orange Pi, Banana Pi, and Raspberry Pi? When I drew this, I was planning to leave it all black and ...

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