Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) ...

On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices” was published by researchers at IBM ...

A new technical paper titled “Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs” ...

A new technical paper titled “Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

A new technical paper titled “Statistics of EUV exposed nanopatterns: Photons to molecular dissolutions” was published by ...