Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

While line dimensions are large by die standards, they’re small by PCB standards. “The minimum solution is a 2µm line width ...

On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices” was published by researchers at IBM ...

A new technical paper titled “Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs” ...

A new technical paper titled “Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

A new technical paper titled “Statistics of EUV exposed nanopatterns: Photons to molecular dissolutions” was published by ...

HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.

Just because the various components in an advanced package work individually and separately doesn't mean they will work ...

Baya Systems emerged from stealth mode less than a year ago. The company announced it had raised more than $36 million in a Series B round led by Maverick Silicon, backed by a strategic investment ...

Moving data is one of the big challenges in the AI world. There is so much data being generated that even moving it back and ...

A new technical paper titled “HBM Roadmap Ver 1.7 Workshop” was published by researchers at KAIST’s TERALAB. The 371-page ...